DIELECTRIC CHARACTERIZATION OF PRINTED-CIRCUIT BOARD SUBSTRATES

被引：3

作者：

RIEDELL, CH ^{[1
]}

STEER, MB ^{[1
]}

KAY, MR ^{[1
]}

KASTEN, JS ^{[1
]}

BASEL, MS ^{[1
]}

POMERLEAU, R ^{[1
]}

机构：

[1] N CAROLINA STATE UNIV,CTR COMMUNICAT & SIGNAL PROC,DEPT ELECT & COMP ENGN,RALEIGH,NC 27695

来源：

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT | 1990年 / 39卷 / 02期

关键词：

D O I：

10.1109/19.52532

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The design and quality assurance of high-speed digital systems requires a fast and accurate method for the electrical characterization of printed circuit substrates. This paper presents a new technique for measuring the dielectric properties of such substrates based on the measured scattering parameters of a transmission line. The method is broad hand, determines the effective permittivity and loss tangent, and is compatible with existing substrate quality assurance schemes. Comparisons with alternative permittivity characterization techniques are presented. © 1990 IEEE

引用

页码：437 / 440

页数：4

共 50 条

[1] CHARACTERIZATION OF POLYMERS USED IN PRINTED-CIRCUIT BOARD MANUFACTURE
SMITH, CA
[J]. POLYMER TESTING, 1987, 7 (02) : 79 - 84
[2] PLATING PRINTED-CIRCUIT SUBSTRATES
POSKANZER, AM
[J]. PLATING AND SURFACE FINISHING, 1983, 70 (07): : 10 - &
[3] Practical considerations in the modeling and characterization of printed-circuit board wiring
Deutsch, A.
Krabbenhoft, R. S.
Surovic, C. W.
Winkel, T-M.
Schuster, C.
Kwark, Y. H.
Klink, E.
[J]. 10TH IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, PROCEEDINGS, 2006, : 119 - +
[4] DYNAMIC STIFFENING OF A PRINTED-CIRCUIT BOARD
LAURA, PAA
ERCOLI, L
LAMALFA, S
[J]. ACUSTICA, 1995, 81 (02): : 196 - 197
[5] SPC IN PRINTED-CIRCUIT BOARD ASSEMBLY
DOBBINS, JG
PADGETT, WJ
[J]. QUALITY PROGRESS, 1993, 26 (07) : 65 - 67
[6] PRINTED-CIRCUIT BOARD BUS BARS
STREDDE, GH
[J]. WESTERN ELECTRIC ENGINEER, 1979, 23 (01): : 19 - 23
[7] CHIP ON HOLE PRINTED-CIRCUIT BOARD
TANIMOTO, M
EDO, K
OKITA, K
SHIGEMASA, J
[J]. SHARP TECHNICAL JOURNAL, 1991, (51): : 77 - 80
[8] PRECISION IN THE PRINTED-CIRCUIT BOARD INDUSTRY
SCARLETT, JA
[J]. PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1981, 3 (04): : 238 - 246
[9] Modeling for printed-circuit board simulation
Balaram, A
[J]. IEEE SPECTRUM, 2000, 37 (10) : 70 - 74
[10] CHARACTERIZATION OF THE FLEXIBLE PRINTED-CIRCUIT BOARD DEVELOPING PROCESS AND SCUM FORMATION
PARKER, JL
[J]. PLATING AND SURFACE FINISHING, 1982, 69 (11): : 47 - 47

← 1 2 3 4 5 →