Technology Roadmap for Beyond 5G Wireless Connectivity in D-band

被引：30

作者：

Dore, Jean-Baptiste ^{[1
]}

Belot, Didier ^{[1
]}

Mercier, Eric ^{[1
]}

Bicais, Simon ^{[1
]}

Gougeon, Gregory ^{[2
]}

Corre, Yoann ^{[2
]}

Miscopein, Benoit ^{[1
]}

Ktenas, Dimitri ^{[1
]}

Strinati, Emilio Calvanese ^{[1
]}

机构：

[1] CEA Leti, Minatec Campus, Grenoble, France

[2] Siradel, St Gregoire, France

来源：

2020 2ND 6G WIRELESS SUMMIT (6G SUMMIT) | 2020年

关键词：

Millimeter wave communications; Integrated circuit technology; Radiofrequency integrated circuits;

D O I：

10.1109/6gsummit49458.2020.9083890

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

Wireless communication in millimeter wave bands, namely above 20 GHz and up to 300 GHz is foreseen as a key enabler technology for the next generation of wireless systems. The huge available bandwidth is contemplated to achieve high data rate wireless communications, and hence, to fulfill the requirements of future wireless networks. Several Beyond SG applications are considered for these systems: high capacity back haul, enhanced hot-spot kiosk as well as short-range Device-to-Device communications. In this paper we propose to discuss the trade-offs between scenario requirements and current silicon technologies limits to draw a technology roadmap for the next generation of wireless connectivity in D-band.

引用

页数：5

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