A Rapid Bonding Method for Fabricating Mixing Microfluidic Chip Based on Micromachining Technology

被引:3
|
作者
Wang, Junyao [1 ]
Hou, Qi [1 ]
Liu, Huan [1 ]
Sun, Qi [1 ]
Yuan, Hengyi [2 ]
机构
[1] Northeast Elect Power Univ, Sch Mech Engn, Jilin 132012, Jilin, Peoples R China
[2] Jilin Engn Normal Univ, Coll Mech Engn, Changchun 130052, Peoples R China
基金
中国国家自然科学基金;
关键词
SHAPED MICRO-MIXER; DESIGN;
D O I
10.1155/2020/8630725
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this paper, a rapid bonding method is reported to fabricate a mixing microfluidic chip. The chip is composed of a glass upper plat and a polyurethane bottom plat. The upper plat with a microchannel is obtained through micromachining technology. And the bottom plat is manufactured via mixing the solution with the component of isocyanic acid and polyether polyol. The influence of the solution's proportion on the contact angle and bonding force is investigated to enhance the hydrophilicity and the bonding strength. Furthermore, a mixing experiment is implemented to verify the chip's bonding effect. The experimental results demonstrate that with increasing the proportions of isocyanic acid and polyether polyol, the contact angle and the bonding force increase at first and then decrease gradually. That is attributed to the variation of internal porous structure for different proportions. Considering the contact angle and the bonding force synthetically, the optimal proportion of 3.7 w/w is confirmed. The mixing efficiency is increased from 0.157 to 0.824. Compared with other bonding methods, the method in this paper has the advantages of high efficiency and high bonding strength.
引用
收藏
页数:7
相关论文
共 50 条
  • [31] Rapid prototyping of PMMA-based microfluidic spheroid-on-a-chip models using micromilling and vapour-assisted thermal bonding
    Monieb A. M. Ahmed
    Klaudia M. Jurczak
    N. Scott Lynn
    Jean-Paul S. H. Mulder
    Elisabeth M. J. Verpoorte
    Anika Nagelkerke
    Scientific Reports, 14
  • [32] Rapid prototyping of PMMA-based microfluidic spheroid-on-a-chip models using micromilling and vapour-assisted thermal bonding
    Ahmed, Monieb A. M.
    Jurczak, Klaudia M.
    Lynn Jr, N. Scott
    Mulder, Jean-Paul S. H.
    Verpoorte, Elisabeth M. J.
    Nagelkerke, Anika
    SCIENTIFIC REPORTS, 2024, 14 (01)
  • [33] A photometric method for organophosphorus pesticide detection based on microfluidic chip
    Yang, N.
    Mao, H.
    Sun, J.
    Xiang, C.
    Xu, P.
    BULGARIAN CHEMICAL COMMUNICATIONS, 2015, 47 (04): : 1147 - 1154
  • [34] A novel bonding method for polymer-based microfluidic platforms
    Lai, SY
    Hudiono, Y
    Lee, LJ
    Daunert, S
    Madou, MJ
    MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VII, 2001, 4557 : 280 - 287
  • [35] A Method for Manufacturing Flexible Microfluidic Chip Based on Soluble Material
    Wang, Junyao
    Chen, Xingyu
    Liu, Huan
    Sun, Gongchen
    Li, Yunpeng
    Lang, Tianhong
    Wang, Rui
    Cui, Bowen
    JOURNAL OF NANOMATERIALS, 2021, 2021
  • [36] A rapid flip chip die bonding method for semiconductor laser diode arrays
    Merritt, SA
    Seiferth, F
    Vusirikala, V
    Dagenais, M
    Chen, YJ
    Stone, DR
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 775 - 779
  • [37] Thermoplastic-based microfluidic chip bonding with PES hot melt adhesive film
    Wang, Yaohua
    Xu, Fan
    Fan, Yiqiang
    JOURNAL OF ADHESION, 2024, 100 (03): : 178 - 185
  • [38] Mixing characteristics of a bubble mixing microfluidic chip for genomic DNA extraction based on magnetophoresis: CFD simulation and experiment
    Sun, Lin
    K. Siddique, Muhammad
    Wang, Lei
    Li, Songjing
    ELECTROPHORESIS, 2021, 42 (21-22) : 2365 - 2374
  • [39] Single Cell Detection Using Self-mixing Interferometry Based On Microfluidic Chip
    Zhang, Menglei
    Zhao, Yu
    Li, Jiawei
    Chen, Tao
    AOPC 2021: BIOMEDICAL OPTICS, 2021, 12067
  • [40] Design and simulation study of microfluidic chip based on the liquid quantitative shunting mixing and detecting
    Xing Xiaodong
    Wang Shiyuan
    Jin Ying
    Wang Liquan
    FERROELECTRICS, 2019, 546 (01) : 57 - 66