Development of a high-strength high-conductivity Cu-Ni-P alloy. Part 1: Characterization of precipitation products

被引:23
|
作者
Murayama, M.
Belyakov, A.
Hara, T.
Sakai, Y.
Tsuzaki, K.
Okubo, M.
Eto, M.
Kimura, T.
机构
[1] Natl Inst Mat Sci, Steel Res Ctr, Tsukuba, Ibaraki 3050047, Japan
[2] Nippon Min & Met Co Ltd, Technol Dev Ctr, Hitachi, Ibaraki 3170056, Japan
关键词
Cu-Ni-P alloy; transmission electron microscopy (TEM); nickel phosphide; precipitation; age hardening; electro-conductivity;
D O I
10.1007/s11664-006-0158-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The precipitation products of a Cu-1.5Ni-0.32P (wt.%) alloy isochronally aged at 400 degrees C and 600 degrees C were investigated by transmission electron microscopy (TEM). There are two different sizes of precipitates formed in the 600 degrees C aged specimen. Large precipitates appear to be lath, the length of which varies from 100 nm to 500 nm, whereas small dotty contrasts around 10 nm in diameter are uniformly distributed in the matrix. Only small dotty contrasts are observed after 400 degrees C aging. In the composition range 0-33.3 at.%P, both the previous studies and the calculated Ni-P binary phase diagram indicated that the possible nickel phosphide phases are Ni3P, Ni12P5, Ni5P2, and Ni2P. However, selected area electron diffraction (SAED) pattern analysis in conjunction with energy dispersive x-ray spectroscopy (EDS) identified the large lath precipitates as Ni12P5 phase. On the other hand, the small precipitates could not be analyzed by EDS due to thinness; thus, the structure is estimated to be a Ni5P4 phase from the relationships between d-spacing and angles between planes measured from a selected area diffraction pattern.
引用
收藏
页码:1787 / 1792
页数:6
相关论文
共 50 条
  • [31] Application of expert-augmented machine learning modeling in high-strength and high-conductivity copper alloy development
    Miao H.
    Xiang C.
    Liu S.
    Huang D.
    Lou H.
    Gongcheng Kexue Xuebao/Chinese Journal of Engineering, 2023, 45 (11): : 1908 - 1917
  • [32] Heat Treatment Effect on the Microstructure and Properties of a High-Strength and High-Conductivity Cu Nb Cu Microcomposite
    Wang, Pengfei
    Zhang, Pingxiang
    Liang, Ming
    Li, Chengshan
    Li, Jinshan
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2019, 29 (04)
  • [33] FATIGUE OF A HIGH-STRENGTH, HIGH CONDUCTIVITY CU-ZR ALLOY
    LEAX, TR
    YESKE, RA
    JOURNAL OF METALS, 1979, 31 (12): : 60 - 60
  • [34] CALPHAD-assisted composition and processing design of high-strength and high-conductivity copper alloy
    Yang, Qi
    Wang, Zhilei
    Xiao, Xingyu
    Xie, Jianxin
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2023, 881
  • [35] HIGH-STRENGTH AND HIGH-CONDUCTIVITY CU-AG ALLOY SHEETS - NEW PROMISING CONDUCTOR FOR HIGH-FIELD BITTER COILS
    SAKAI, Y
    INOUE, K
    MAEDA, H
    IEEE TRANSACTIONS ON MAGNETICS, 1994, 30 (04) : 2114 - 2117
  • [36] A COPPER-BASE ALLOY CONTAINING IRON AS A HIGH-STRENGTH, HIGH-CONDUCTIVITY WIRE MATERIAL
    HODGE, W
    JAFFEE, RI
    DUNLEAVY, JG
    OGDEN, HR
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1949, 180 : 32 - 41
  • [37] Microstructural size effects in high-strength high-conductivity Cu-Cr-Nb alloys
    Anderson, KR
    Groza, JR
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2001, 32 (05): : 1211 - 1224
  • [38] Microstructural size effects in high-strength high-conductivity Cu-Cr-Nb alloys
    Ken R. Anderson
    Joanna R. Groza
    Metallurgical and Materials Transactions A, 2001, 32 : 1211 - 1224
  • [39] Microstructure and Mechanical/Electrical Properties of Nanostructured High-strength, High-conductivity (HSHC) Cu Material
    Lin, Zhigang
    Tan, Chuhu
    Liu, Bob
    TMS 2009 138TH ANNUAL MEETING & EXHIBITION - SUPPLEMENTAL PROCEEDINGS, VOL 3: GENERAL PAPER SELECTIONS, 2009, : 545 - 550
  • [40] Microstructure and properties of high-strength and high-conductivity Cu-3Cr/Graphene composites
    Zhang, Xiaoyan
    Lei, Qian
    Li, Xu
    Li, Qingbo
    Meng, Xiangyue
    MATERIALS TODAY COMMUNICATIONS, 2024, 40