High power, low cost ceramic quadrature couplers

被引:0
|
作者
Anon
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:220 / +
页数:2
相关论文
共 50 条
  • [41] Novel Dual-Band Coupled-Line Quadrature Couplers with Unequal Power Division
    Jiao, Lingxiao
    Wu, Yongle
    Liu, Yuanan
    ELECTROMAGNETICS, 2016, 36 (04) : 249 - 261
  • [42] A New Low-Power High Frequency CMOS Quadrature LC-VCO
    Wang, Chunhua
    Yang, Changyong
    2008 4TH INTERNATIONAL CONFERENCE ON WIRELESS COMMUNICATIONS, NETWORKING AND MOBILE COMPUTING, VOLS 1-31, 2008, : 2330 - 2333
  • [43] High Dynamic Range Low Power Drive Quadrature Millimeter-wave Demodulator
    Zouggari, B.
    Hammou, D.
    Hannachi, C.
    Tatu, S. O.
    2018 48TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2018, : 255 - 258
  • [44] A Low Cost, Low Power AES ASIC with High DPA Resisting Ability
    Yu, Bo
    Li, Xiangyu
    Zhang, Naiwen
    Sun, Yihe
    2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC), 2009, : 285 - 288
  • [45] A LOW-COST HIGH-POWER MICROWAVE RECEIVER
    DYBDAL, RB
    MORI, TT
    CASTANEDA, AM
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1992, 41 (03) : 349 - 352
  • [46] Low cost, high thermal conductivity composites for power electronics
    Kowbel, W
    Patel, K
    Champion, W
    Withers, JC
    Choi, S
    BRIDGING THE CENTURIES WITH SAMPE'S MATERIALS AND PROCESSES TECHNOLOGY, VOL 45, BOOKS 1 AND 2, 2000, : 527 - 533
  • [47] High power low cost drive laser for LPP source
    Fomenkov, Igor V.
    Hansson, Bjorn A. M.
    Bowering, Norbert R.
    Ershov, Alex I.
    Partlo, William N.
    EMERGING LITHOGRAPHIC TECHNOLOGIES X, PTS 1 AND 2, 2006, 6151 : U1543 - U1551
  • [48] Low cost, high density, power packaging for space systems
    Lynch, F
    PROCEEDINGS OF THE FIFTH EUROPEAN SPACE POWER CONFERENCE (ESPC), VOLS 1 AND 2, 1998, 416 : 415 - 420
  • [49] Low cost plastic packaging for high-power limiters
    Coffman, ZE
    Teti, RJ
    Miller, SC
    Gribbons, MA
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2002, : 79 - 82
  • [50] LOW COST COOLING DEVICE FOR HIGH POWER LED LAMPS
    Pamela, Martinez-Vega
    Araceli, Lopez-Badillo
    Luis, Luviano-Ortiz J.
    Abel, Hernandez-Guerrero
    Jaime G., Cervantes
    PROCEEDINGS OF THE ASME 2020 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2020, VOL 11, 2020,