Dynamic compact thermal model of high power light emitting diode

被引：1

作者：

Lai, Wei ^{[1
]}

Liu, Xianming ^{[1
]}

Chen, Weimin ^{[1
]}

Lei, Xiaohua ^{[1
]}

Cao, Xueying ^{[1
]}

机构：

[1] Chongqing Univ, Coll Optoelect Engn, Minist Educ, Key Lab Optoelect Technol & Syst, Chongqing 400044, Peoples R China

来源：

MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 12期

关键词：

Dynamic compact thermal model; Time constant spectra; Thermal resistance; Light emitting diode; DIE ATTACH; TRANSIENT; PERFORMANCE; RESISTANCE;

D O I：

10.1016/j.microrel.2015.10.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Dynamic compact thermal model plays important roles in predicting the junction temperature and characterizing the transient thermal behavior of an electronic device. In this paper, analytical dynamic compact thermal model for high power LEDs is established based on the three-directional heat flow paths under junction-to-ambient definition. Comparative results with finite element method model indicate that the presented model is accurate and efficient. It is further reduced by analyzing the influence of different components of the LED package. Good agreement with experimental results confirms that the reduced analytical model can predict the junction temperature and characterize the thermal behavior effectively. (C) 2015 Elsevier Ltd. All rights reserved.

引用

页码：2663 / 2670

页数：8

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