Dynamical and thermal modelling of creep and relaxation for force and weight sensors

被引：3
|
作者：
Rouff, M
Lakhdari, Z
Cotsaftis, M
Konieczka, S
机构：
[1] UCBN, Lab Univ Sci Appl Cherbourg, F-50130 Octeville, France
[2] ECE, Lab Tech Mecatron & Elect, F-75007 Paris, France
[3] Ecole Normale Super, Lab Genie Mecan, F-94235 Cachan, France
来源：
MECHATRONICS | 2003年 / 13卷 / 01期
关键词：
D O I：
10.1016/S0957-4158(01)00083-6
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
We present in this article analytic formulations of creep and relaxation processes, including thermal variation, for force and weight mechatronic sensors. We found that these phenomena can be modelled by a two timescales process for the dynamical behaviour of creep and relaxation, and that under a quasi static assumption of the temperature evolution thermal variation can be given, under usual range of temperature, by a polynomial representation of low order. (C) 2002 Published by Elsevier Science Ltd.
引用
收藏
页码：77 / 84
页数：8
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