Laser-assisted metal deposition from CuSO4-based electrolyte solution

The copper spots were precipitated on the SiO2 substrates with Laser-induced Chemical Liquid phase Deposition (LCLD) method. The focused beam of the CW Ar+ laser generated in the multiwave regime was used for the metal precipitation. The deposition process was initiated by a laser-assisted photothermal chemical reaction, which results in the reduction of the metal complexes to the metal. To minimize the negative influence of the bubbles formation phenomenon the "substrate-side" geometry of the metal deposition has been suggested. The dependence of the metal precipitation process on the laser power and the deposition time was studied. Laser power 240 mW was found to be the threshold value for the metal deposition from the CUSO4-based electrolyte solution at the temperature 298 K.