A Review on Humidity, Temperature and Strain Printed Sensors-Current Trends and Future Perspectives

被引:57
|
作者
Barmpakos, Dimitris [1 ,2 ,3 ]
Kaltsas, Grigoris [1 ]
机构
[1] Univ West Attica, Dept Elect & Elect Engn, MicroSENSES Lab, Ancient Olive Grove Campus, Athens 12243, Greece
[2] Natl Ctr Sci Res Demokritos, Inst Nanosci & Nanotechnol, POB 60037, Athens 15310, Greece
[3] Univ Patras, Dept Phys, Patras 26504, Greece
关键词
printed humidity sensor; printed temperature sensor; printed strain sensor; flexible sensor; multi-material sensor; printed electronics; flexible electronics; COMPOSITE; ELECTRODE; SENSITIVITY; FABRICATION; CARBON; ARRAY; POWER;
D O I
10.3390/s21030739
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Printing technologies have been attracting increasing interest in the manufacture of electronic devices and sensors. They offer a unique set of advantages such as additive material deposition and low to no material waste, digitally-controlled design and printing, elimination of multiple steps for device manufacturing, wide material compatibility and large scale production to name but a few. Some of the most popular and interesting sensors are relative humidity, temperature and strain sensors. In that regard, this review analyzes the utilization and involvement of printing technologies for full or partial sensor manufacturing; production methods, material selection, sensing mechanisms and performance comparison are presented for each category, while grouping of sensor sub-categories is performed in all applicable cases. A key aim of this review is to provide a reference for sensor designers regarding all the aforementioned parameters, by highlighting strengths and weaknesses for different approaches in printed humidity, temperature and strain sensor manufacturing with printing technologies.
引用
收藏
页码:1 / 24
页数:24
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