Opportunities in Uncooled Infrared Imaging: A MEMS Perspective

被引：3
|
作者：
Jones, Christopher D. W.
Bolle, Cristian A. [1 ,2 ]
Ryf, Roland [3 ,4 ]
Simon, Maria Elina
Pardo, Flavio
Basavanhally, Nagesh
Ramirez, Arthur P. [5 ]
机构：
[1] Harvard Univ, Charles Lieber Grp, Cambridge, MA 02138 USA
[2] Bell Labs, Phys Sci Grp, Murray Hill, NJ 07974 USA
[3] Bell Labs, Photon Subsyst Dept, Murray Hill, NJ USA
[4] Bell Labs, Adv Photon Res Dept, Murray Hill, NJ USA
[5] Bell Labs, Device Phys Res Dept, Murray Hill, NJ USA
来源：
BELL LABS TECHNICAL JOURNAL | 2009年 / 14卷 / 03期
关键词：
ABSORBER;
D O I：
10.1002/bltj.20389
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Infrared imaging spans a wide range of wavelengths, underlying technologies, and applications. Advancements in cost reduction and performance have the potential for opening up new markets, for both military and consumer applications. Micromachining and wafer fabrication technologies are critical for the production of infrared (IR) sensor arrays. This paper investigates ways in which micro-electro-mechanical systems (MEMS) design experience can be applied to uncooled IR imaging in the areas of direct view and multispectral sensor technology. (C) 2009 Alcatel-Lucent.
引用
收藏
页码：85 / 98
页数：14
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