Demonstration of Board-Level Optical Link with Ceramic Optoelectronic Multi-Chip Module

被引：5
|
作者：
Nieweglowski, Krzysztof [1 ]
Rieske, Ralf [1 ]
Wolter, Klaus-Juergen [1 ]
机构：
[1] Tech Univ Dresden, Elect Packaging Lab, D-01062 Dresden, Germany
来源：
2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 | 2009年
关键词：
D O I：
10.1109/ECTC.2009.5074276
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper demonstrates a complete short-distance parallel optical interconnection on PCB-level basing on ceramic transmitter/receiver modules for high-speed signal conversion, integrated polymeric waveguides and the optical coupling elements. The novel technology for the structuring of PCB-compatible high density parallel optical interconnects will be described in detail. The solution for the optical coupling into the integrated waveguides is based on a micro-optical indirect coupling element with wave guiding structures. The demonstrated optoelectronic modules are 4-channel BGA ceramic multi-chip modules with 4 x 10 Gbps transmission capacity.
引用
收藏
页码：1879 / 1886
页数：8
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