Elastic-plastic deformation of single-crystal silicon in nano-cutting by a single-tip tool

A material removal mechanism of a single-tip tool cutting/scratch is the foundation for the analysis and prediction of the grinding process. A novel method for conducting single-tip, relatively high speed, and force-measurable nano-cutting tests with controllable cutting length are proposed to investigate the elastic-plastic deformation. Nano-cutting tests of single-crystal silicon are implemented at the cutting speeds of 0.1 m s(-1) and 1 m s(-1) which are close to the real grinding speed and much higher than that of single-tip tool scratch tests reported. Remarkable elastic recovery rate over 50% is observed in both cutting speeds. A semi-empirical model describing the relationship between the elastic recovery rate and residual depth is proposed. The normal force is studied in the whole cutting range. The findings of the elastic-plastic deformation behavior under relatively high cutting speed are valuable for the further mechanisms and process analysis of the ultra-fine grinding of brittle materials. (C) 2019 The Japan Society of Applied Physics