High RF Performance AlGaN/GaN HEMT Fabricated by Recess-Arrayed Ohmic Contact Technology

被引:49
|
作者
Lu, Yang [1 ]
Ma, Xiaohua [2 ]
Yang, Ling [2 ]
Hou, Bin [2 ]
Mi, Minhan [1 ]
Zhang, Meng [2 ]
Zheng, Jiaxin [2 ]
Zhang, Hengshuang [1 ]
Hao, Yue [1 ]
机构
[1] Xidian Univ, Sch Microelect, State Key Discipline Lab Wide Band Gap Semicond T, Xian 710071, Shaanxi, Peoples R China
[2] Xidian Univ, Sch Adv Mat & Nanotechnol, State Key Discipline Lab Wide Band Gap Semicond T, Xian 710071, Shaanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
AlGaN/GaN HEMT; high efficiency; ohmic contact resistance; patterned etching; power application; RESISTANCE; GANHEMTS; VOLTAGE;
D O I
10.1109/LED.2018.2828860
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, a high-performance gate-recessed AlGaN/GaN high electron mobility transistor (HEMT) fabricated by the recess-arrayed ohmic contact technology is presented. An array of square columns was etched in the ohmic region, using Ti/Al/Ni/Au metal deposition and rapid annealing to fabricate a low-resistance ohmic contact. By using the transmission line method measurement, an ohmic contact resistance (R-c) of 0.12 Omega . mm is measured, which is 70% lower than that of the reference device. The patterned ohmic contact HEMT (POC HEMT) exhibits the saturation current of 1130 mA/mm at V-ds = 10 V and V-gs = 1 V, with a shift of the knee voltage from 6 V to 3 V. The RF measurement shows the power-added efficiency (PAE) of 71.6% at 5 GHz. After the third harmonic tuning, the PAE of 85.2% and the corresponding power density of 11.2W/mm and power gain of 16.9 dB are obtained. According to the achieved results, the recess-arrayed ohmic contact processed GaN HEMT has a great potential for high RF efficiency and power applications.
引用
收藏
页码:811 / 814
页数:4
相关论文
共 50 条
  • [21] Reduced Contact Resistance and Improved Transistor Performance by Surface Plasma Treatment on Ohmic Regions in AlGaN/GaN HEMT Heterostructures
    Yadav, Yogendra Kumar
    Upadhyay, Bhanu B.
    Meer, Mudassar
    Ganguly, Swaroop
    Saha, Dipankar
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2018, 215 (09):
  • [22] Fabrication of AlGaN/GaN HEMT with the improved ohmic contact by encapsulation of silicon dioxide thin film
    Heo, Jong-Gon
    Sung, Ho-Kun
    Lim, Jong-Won
    Kim, Shin-Keun
    Park, Won-Kyu
    Ko, Chul-Gi
    2010 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (MTT), 2010,
  • [23] High performance millimeter-wave InAlN/GaN HEMT for low voltage RF applications via regrown Ohmic contact with contact ledge structure
    Zhou, Yuwei
    Mi, Minhan
    Yang, Mei
    Han, Yutong
    Wang, Pengfei
    Chen, Yilin
    Liu, Jielong
    Gong, Can
    Lu, Yiwei
    Zhang, Meng
    Zhu, Qing
    Ma, Xiaohua
    Hao, Yue
    APPLIED PHYSICS LETTERS, 2022, 120 (06)
  • [24] Study of Ti/Si/Ti/Al/Ni/Au ohmic contact for AlGaN/GaN HEMT
    Shostachenko, S. A.
    Porokhonko, Y. A.
    Zakharchenko, R. V.
    Burdykin, M. S.
    Ryzhuk, R. V.
    Kargin, N. I.
    Kalinin, B. V.
    Belov, A. A.
    Vasiliev, A. N.
    XVII WORKSHOP ON HIGH ENERGY SPIN PHYSICS (DSPIN-2017), 2018, 938
  • [25] High-performance AlGaN-GaN HEMT materials and devices grown and fabricated on Si substrates
    Feng, Z. H.
    Yin, J. Y.
    Yuan, F. P.
    Liu, B.
    Feng, Z.
    Cai, S. J.
    THIN FILM PHYSICS AND APPLICATIONS, SIXTH INTERNATIONAL CONFERENCE, 2008, 6984
  • [26] High performance of AlGaN/GaN HEMT with AlN cap layer
    Luo, Xin
    Cui, Peng
    Zhang, Tieying
    Yan, Xinkun
    Chen, Siheng
    Wang, Liu
    Dai, Jiacheng
    Linewih, Handoko
    Lin, Zhaojun
    Xu, Xiangang
    Han, Jisheng
    MICRO AND NANOSTRUCTURES, 2025, 198
  • [27] Low resistance Ti/Si/Ti/Al/Ni/Au ohmic contact for AlGaN/GaN HEMT
    Shostachenko, Stanislav A.
    Zakharchenko, Roman V.
    Ryzhuk, Roman V.
    Kulyamina, Darya A.
    Kargin, Nikolay I.
    INTERNATIONAL CONFERENCE ON MICRO- AND NANO-ELECTRONICS 2016, 2016, 10224
  • [28] Low surface damage during ohmic contact formation in AlGaN/GaN HEMT by selective laser annealing
    Hou, Mingchen
    Xie, Gang
    Sheng, Kuang
    ELECTRONICS LETTERS, 2019, 55 (11) : 658 - 659
  • [29] Ti/Al/Ni/Cu Ohmic Contact with Low Contact Resistance and Smooth Surface Morphology for AlGaN/GaN HEMT
    Wong, Y. -Y.
    Chang, E. Y.
    Chen, Y. -K.
    Liu, S. -C.
    Lin, Y. -C.
    Ma, J. -S.
    WIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 15, 2014, 61 (04): : 329 - 336
  • [30] The effect of post-metal annealing on DC and RF performance of AlGaN/GaN HEMT
    Akoglu, Busra Cankaya
    Yilmaz, Dogan
    Salkim, Gurur
    Ozbay, Ekmel
    ENGINEERING RESEARCH EXPRESS, 2022, 4 (04):