Suppression of leakage and crosstalk in typical millimeter-wave flip-chip packages

被引：1
|
作者：
Lee, GA
Lee, HY
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1997年
关键词：
D O I：
10.1109/EPEP.1997.634069
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Leakage phenomena of flip-chip structures on common GaAs and alumina main substrates are characterized using the spectral domain approach to reduce the possible chip-to-chip crosstalk and transmission resonance. We have found that the longitudinal section magnetic mode is dominant for the coplanar waveguide leakage and the leakage can be suppressed by properly managing the gap height and the main substrate thickness in addition to the dielectric constant.
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页码：195 / 198
页数：4
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