Printed-wiring-board microfluidics for thermal management of electronic systems

This work presents the use of organic multilayer lamination of epoxy-glass printed wiring board material to produce microfluidic structures, and the exploitation of these structures along with integrated, low profile synthetic jet drivers, to produce an active cooling substrate (ACS) in which fluidic cooling functionality as well as electrical functionality are incorporated into the same, low-profile substrate. Test heater chips have been bonded to the substrate, and the substrate and drivers have been characterized mechanically, electrically, and thermally. Peak jet velocities of 14 m/s and average jet velocities of approximately 3 m/s have been achieved at actuator powers of 60 mW. Thermal characterization of the ACS/test chip combination indicates that the ACS has superior cooling performance than that of a traditional fan.