Joining of Graphite to Copper with Nb Interlayer: Microstructure and Mechanical Properties

被引：18

作者：

Xing, Lili ^{[1
]}

Lin, Jincheng ^{[1
]}

Huang, Mei ^{[1
]}

Yang, Weiqi ^{[1
]}

机构：

[1] Sun Yat Sen Univ, Sino French Inst Nucl Engn & Technol, Zhuhai 519000, Peoples R China

来源：

ADVANCED ENGINEERING MATERIALS | 2019年 / 21卷 / 02期

基金：

中国国家自然科学基金;

关键词：

brazing; graphite; mechanical property; microstructure; transient liquid phase bonding; RESIDUAL-STRESSES; JOINTS; RELIEF;

D O I：

10.1002/adem.201800810

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Reliable joining of graphite and copper is achieved by means of a multilayer structure: niobium, which is used as stress-relief interlayer, is joined to copper on one side by transient liquid phase (TLP) bonding and to graphite on the other side, using Ti/Cu foils as a filler alloy. The joints prepared by different parameters are analyzed in terms of microstructure, joint strength, and fracture behavior. With low joining temperature and low Ti content, a ductile banded Cu/TiCu4 layer forms between graphite and Nb by peritectic reaction. The dissolution-precipitation of Nb in TiC particles can help to reduce the brittleness on graphite interface. The TLP bonding between Nb and copper results in a narrow diffusion layer in copper substrate. The maximum shear strength of joints reaches 32 MPa as using 11.3 wt% Ti at 1000 degrees C. The fracture modes change from bowl shape cracks in graphite/Cu joints to multi-step cracks in graphite/Nb/Cu joints.

引用

页数：8

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