RF Front-End Test Using Built-in Sensors

被引：17

作者：

Abdallah, Louay

Stratigopoulos, Haralampos-G. ^{[1
]}

Mir, Salvador ^{[1
]}

Kelma, Christophe ^{[2
]}

机构：

[1] TIMA Lab, French Natl Res Council CNRS, F-38031 Grenoble, France

[2] NXP Semicond, Eindhoven, Netherlands

来源：

IEEE DESIGN & TEST OF COMPUTERS | 2011年 / 28卷 / 06期

关键词：

LOW-COST TEST; ANALOG;

D O I：

10.1109/MDT.2011.131

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This article proposes a new class of sensors for built-in test in RF devices. These sensors are placed in close proximity to the DUT on the same substrate without being electrically connected to it. Instead, they monitor it by virtue of being subjected to the same process variations. The authors also describe other types of sensors they have studied, including DC probes, an envelope detector, and a current sensor.

引用

页码：76 / 84

页数：9

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