Nanohardness of copper in the vicinity of grain boundaries

被引：80
|
作者：
Soifer, YM
Verdyan, A
Kazakevich, M
Rabkin, E [1 ]
机构：
[1] Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel
[2] Holon Acad Inst Technol, Dept Sci, IL-58102 Holon, Israel
来源：
SCRIPTA MATERIALIA | 2002年 / 47卷 / 12期
关键词：
nanoindentation; grain boundaries; dislocations;
D O I：
10.1016/S1359-6462(02)00284-1
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The nanohardness in the vicinity of grain boundaries in high purity Cu was investigated. It was found that the nanohardness increases while approaching the grain boundary, the characteristic distance at which the grain boundary influences the nanohardness being in the range of few micrometers. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：799 / 804
页数：6
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