Recycling system for printed wiring boards with mounted parts

被引:10
|
作者
Yokoyama, S [1 ]
Ikuta, Y [1 ]
Iji, M [1 ]
机构
[1] NEC Corp Ltd, Resources & Environm Protect Res Labs, Miyamae Ku, Kawasaki, Kanagawa 2168555, Japan
关键词
D O I
10.1109/ECODIM.1999.747721
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
A practical recycling system has been developed for printed wiring boards (PWBs) with electronic parts mounted on them. This system consists of part-removing, solder-removing , and resin-board pulverizing/separating pl processes, and is effective in the recovery of useful materials, We have developed a part-removal apparatus which successfully removes through-hole devices as well as surface mounted devices from PWBs with almost no damage to the devices themselves. Most of the solder is removed by the part-removal, and later by surface abrasion followed by heat/impact, After the removal of parts a,and solder, the resin-boards are pulverized and the resulting powder is then separated into two types: a copper-rich powder and a powder which consists of glass fiber and resin (GR powder), The copper-rich powder is a good copper resource for refining: the GR powder is usable as a filler for polymer products. Recovered parts which contains valuable metal resources (including gold), can be refined out as is most commonly the case in other recycling systems, but a more economic and ecologically sound approach would be to exploit the potential of parts removed in this system to be reused for their original pill-poses after being checked for reliability.
引用
收藏
页码:814 / 817
页数:4
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