77-GHz MMIC module design techniques for automotive radar applications

被引:1
|
作者
Itoh, Y [1 ]
Honjo, K
机构
[1] Shonan Inst Technol, Fujisawa, Kanagawa 2518511, Japan
[2] Univ Electrocommun, Chofu, Tokyo 1828585, Japan
来源
IEICE TRANSACTIONS ON ELECTRONICS | 2005年 / E88C卷 / 10期
关键词
millimeter-wave; MMIC; module; automotive radar sensor; MCM; SiP; SoC; flip-chip;
D O I
10.1093/ietele/e88-c.10.1939
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving front high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.
引用
收藏
页码:1939 / 1946
页数:8
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