Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench

被引：12
|
作者：
Schuster, C [1 ]
Kuchta, DM [1 ]
Colgan, EG [1 ]
Cohen, GM [1 ]
Trewhella, JM [1 ]
机构：
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2003年
关键词：
D O I：
10.1109/EPEP.2003.1250001
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
In this paper the electrical package design for a 10 Gbps laser diode on a silicon optical bench will be presented. Specifically the wideband impedance matching is addressed Simulated data will be compared to measurements.
引用
收藏
页码：63 / 66
页数：4
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