Transient thermal analysis and optimization of convective-radiative porous fin under the influence of magnetic field for efficient microprocessor cooling

被引:24
|
作者
Oguntala, George [1 ]
Abd-Alhameed, Raed [1 ]
Ngala, Mohammed [1 ]
机构
[1] Univ Bradford, Fac Engn, Dept Biomed & Elect Engn, Bradford, W Yorkshire, England
关键词
Microprocessor cooling; Porous fin; Consumer electronics; Finite volume method; Particle swarm optimization; HEAT-TRANSFER; NATURAL-CONVECTION; COLLOCATION METHOD; TEMPERATURE; CONDUCTIVITY; PREDICTION; PERFORMANCE; GENERATION; SURFACE; FLOW;
D O I
10.1016/j.ijthermalsci.2019.106019
中图分类号
O414.1 [热力学];
学科分类号
摘要
With the continuous evolution of the electronics industry, the trend towards miniaturization in consumer electronic imposes serious challenge of excess heat. Moreover, increasing the microprocessor performance require an increase in the power density which is associated with increased heat dissipation. Porous fins are widely established as viable thermal candidate to achieve effective cooling. In this work, transient thermal analysis and optimization of a longitudinal porous fin under magnetic field subjected to a conductive-convective-radiative mechanism is presented. The developed model is solved using the finite volume method (FVM). Optimization of key fin performance parameters is carried out using particle swarm optimization technique. From the present study, it is established that increase in thermal conductivity parameter enhances heat transfer from the base of the fin to its tip influenced by the radiative diffusion process. Moreover, the study shows that an increase in the porosity effect reduces the overall fin efficiency. Furthermore, the fin thermal behaviour improves in the convective and radiative heat transfer as well as in the magnetic field. The practical implication of the present study is the effective thermal management of various single and mull-layer microprocessor-based consumer electronics.
引用
收藏
页数:11
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