Semi-insulating polyimide as a high resistive material

被引：0
|
作者：
Iida, K [1 ]
Mori, H [1 ]
Nakamura, S [1 ]
Sawa, G [1 ]
机构：
[1] Mie Univ, Dept Elect & Elect Engn, Tsu, Mie 5148507, Japan
来源：
1998 INTERNATIONAL SYMPOSIUM ON ELECTRICAL INSULATING MATERIALS, PROCEEDINGS | 1998年
关键词：
D O I：
10.1109/ISEIM.1998.741712
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new polymer, designed by extending pi electron systems along the molecular chain, has been studied from the view point of a high resistive or semi-insulating material. A high resistive polyimide thin film of 10(12)-10(14) Omega cm without a large absorption current below 40kV/cm has been obtained by the vapor deposition polymerization with pyromellitic dianhydride and 4,4'-diaminostilbene. It is also found that an increase in the orientation of molecular chain axis with decreasing thickness yields lower resistivity and that the orientation of pyromellitdiimide has little effect on the resistivity.
引用
收藏
页码：169 / 172
页数：4
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