A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials

被引:14
|
作者
Hu, Wen [1 ]
Gu, Yan [1 ]
Fan, Chia-Ming [2 ,3 ]
机构
[1] Qingdao Univ, Sch Math & Stat, Qingdao 266071, Peoples R China
[2] Natl Taiwan Ocean Univ, Dept Harbor & River Engn, Keelung 20224, Taiwan
[3] Natl Taiwan Ocean Univ, Computat & Simulat Ctr, Keelung 20224, Taiwan
基金
中国国家自然科学基金;
关键词
Meshless method; Generalized finite difference method; Functionally graded materials; Inverse Cauchy problems; Three-dimensional steady-state heat conduction problem; FINITE-DIFFERENCE METHOD; SINGULAR BOUNDARY METHOD; FUNDAMENTAL-SOLUTIONS; CAUCHY-PROBLEM; NONSINGULAR METHOD; FRACTURE-ANALYSIS; EQUATIONS;
D O I
10.1016/j.enganabound.2020.02.001
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This short communication documents the first attempt to apply the generalized finite difference method (GFDM) for inverse heat conduction analysis of functionally graded materials (FGMs). The fact that the GFDM is a meshless collocation method makes it particularly attractive in solving problems with complex geometries and high dimensions. By employing the Taylor series expansion and the moving least-squares technique, the method produces sparse and banded matrix which makes it possible to perform large-scale simulations. Three benchmark examples are provided to demonstrate the accuracy and adaptability of the GFDM approach in solving the inverse Cauchy problems. The convergence and stability of the method with respect to the amount of noise added into the input data are analyzed.
引用
收藏
页码:1 / 7
页数:7
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