Facile Preparation of High-Performance Elastically Stretchable Interconnects

被引:36
|
作者
Polywka, Andreas [1 ]
Jakob, Timo [1 ]
Stegers, Luca [1 ]
Riedl, Thomas [2 ]
Goerrn, Patrick [1 ]
机构
[1] Berg Univ Wuppertal, Chair Large Area Optoelect, D-42119 Wuppertal, Germany
[2] Berg Univ Wuppertal, Inst Elect Devices, D-42119 Wuppertal, Germany
关键词
electroless deposition; lithography; poly(dimethylsiloxane) (PDMS); silver; stretchable; METAL CONDUCTORS; GOLD CONDUCTORS; ELECTRONICS; DEPOSITION; SURFACES; SILICON; POLYMER; RUBBER; FILMS;
D O I
10.1002/adma.201501461
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Sites on poly(dimethylsiloxane) are selected by ultraviolet exposure. In a subsequent electroless deposition, solid silver films are created on the selected sites only. In this way, facile vacuum-free deposition of electrodes from the liquid phase and their photoresist-and solvent-free patterning are realized. The technique enables reliable rigid-to-soft interconnects that are reversibly stretchable under arbitrary and changing stretching directions.
引用
收藏
页码:3755 / 3759
页数:5
相关论文
共 50 条
  • [1] Facile Preparation of High-Performance Stretchable Fiber-Like Electrodes and Supercapacitors
    Ren, Danyang
    Dong, Liubing
    Wang, Jinjie
    Ma, Xinpei
    Xu, Chengjun
    Kang, Feiyu
    [J]. CHEMISTRYSELECT, 2018, 3 (16): : 4179 - 4184
  • [2] Interconnects for elastically stretchable and deformable electronic surfaces
    Jones, J
    Lacour, SP
    Wagner, S
    [J]. Materials, Technology and Reliability of Advanced Interconnects-2005, 2005, 863 : 399 - 404
  • [3] High-performance interconnects
    Petrini, F
    Lysne, A
    Brightwell, R
    [J]. IEEE MICRO, 2006, 26 (03) : 7 - 9
  • [4] Stretchable hybrid electronics: combining rigid electronic devices with stretchable interconnects into high-performance on-skin electronics
    Lee, Byeongmoon
    Cho, Hyeon
    Jeong, Sujin
    Yoon, Jaeyoung
    Jang, Dongju
    Lee, Dong Keon
    Kim, Dahyun
    Chung, Seungjun
    Hong, Yongtaek
    [J]. JOURNAL OF INFORMATION DISPLAY, 2022, 23 (03) : 163 - 184
  • [5] Polymers for high-performance interconnects
    Taylor, Kelly J.
    Jeng, Shin-Puu
    Eissa, Mona
    Gaynor, Justin
    Nguyen, Hoan
    [J]. 1997, Elsevier Sci B.V., Amsterdam, Netherlands (37-38)
  • [6] High-performance stretchable thermoelectric generator using serpentine interconnects encapsulated in an ultrasoft silicone sponge
    Koshi, Tomoya
    Okawa, Kenjiro
    Amagai, Yasutaka
    Sakamoto, Norihiko
    Nomura, Ken-ich
    Yoshida, Manabu
    [J]. FLEXIBLE AND PRINTED ELECTRONICS, 2022, 7 (02):
  • [7] A facile preparation of hausmannite as a high-performance catalyst for toluene combustion
    Liu, Qi
    Cheng, Gao
    Sun, Ming
    Yu, Weixiong
    Xiaohong
    Zeng
    Tang, Shichang
    li, Yongfeng
    Yu, Lin
    [J]. CHINESE JOURNAL OF CHEMICAL ENGINEERING, 2022, 44 : 392 - 401
  • [8] A facile preparation of hausmannite as a high-performance catalyst for toluene combustion
    Qi Liu
    Gao Cheng
    Ming Sun
    Weixiong Yu
    Xiaohong Zeng
    Shichang Tang
    Yongfeng li
    Lin Yu
    [J]. Chinese Journal of Chemical Engineering, 2022, (04) : 392 - 401
  • [9] Optical Interconnects for High-Performance Computing
    Taubenblatt, Marc A.
    [J]. JOURNAL OF LIGHTWAVE TECHNOLOGY, 2012, 30 (04) : 448 - 458
  • [10] High-performance interconnects: An integration overview
    Havemann, RH
    Hutchby, JA
    [J]. PROCEEDINGS OF THE IEEE, 2001, 89 (05) : 586 - 601