Ultra-Short-Reach Interconnects for Package-Level Integration

被引：0

作者：

Carusone, Anthony Chan ^{[1
]}

Dehlaghi, Behzad ^{[1
]}

Beerkens, Rudy ^{[2
]}

Tonietto, Davide ^{[2
]}

机构：

[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 1A1, Canada

[2] Huawei Canada Res Ctr, HiSilicon Div, Ottawa, ON, Canada

来源：

2016 IEEE OPTICAL INTERCONNECTS CONFERENCE (OI) | 2016年

关键词：

CMOS TECHNOLOGY; 32; NM;

D O I：

暂无

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Package-level integration of disparate technologies on either silicon interposers or organic packaging substrates is a key enabler for future optical subsystems. High-performance computing and networking applications will require tremendous interconnection bandwidth between co-packaged dies. To make package-level integration seamless, transceivers for these ultra-short-reach links must fit within vanishingly small area and power footprints.

引用

页码：10 / 11

页数：2

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