Will silicon survive Moore's law?

被引：0

|

作者：

Sheppard, Laurel M.

机构：

来源：

AMERICAN CERAMIC SOCIETY BULLETIN | 2008年 / 87卷 / 04期

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D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

As device dimensions become smaller, chip manufacturers face material challenges to maintain performance.

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页码：18 / 22

页数：5

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