ICS Advent delivers full integration services to Agilent Technologies

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CONTROL SOLUTIONS | 2001年 / 74卷 / 06期
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TP [自动化技术、计算机技术];
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    Bednar, Peter
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    Sakellaris, John K.
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    Nakamura, M
    Ueda, H
    Makino, S
    Yokotani, T
    Oshima, K
    [J]. JOURNAL OF LIGHTWAVE TECHNOLOGY, 2004, 22 (11) : 2631 - 2640
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    Astier, A.
    Boutry, H.
    Di Cioccio, L.
    Henry, D.
    Leduc, P.
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    Fonstad, Clifton G.
    [J]. OPTICS EXPRESS, 2008, 16 (18): : 13955 - 13960