Low-temperature thick-film dielectrics and resistors for metal substrates

In this work, a set of low-temperature thick-film dielectrics consisting of two high-lead low-temperature glasses, stabilised by various amounts of alumina filler, is characterised on alumina and aluminium metal, as a function of firing temperature. Corresponding resistors based on the same glasses as the dielectrics, but with RuO2 as a conductive phase, were studied on the dielectrics. The purpose of these materials is to enable deposition of thick-film electronics onto substrates such as glass and metals (steel, aluminium, brass, titanium), which cannot be exposed to the standard high-temperature 850 degrees C thick-film firing cycle. Satisfactory insulating properties were obtained, and the properties of the resulting resistors are promising, but managing thermal mismatch was found to be a major issue regarding the mechanical integrity. (c) 2005 Elsevier Ltd. All rights reserved.