Measuring Subsurface Damage of the Ground Sample by Roughness along the Bevel

被引：0

作者：

Wang, Hairong ^{[1
]}

Sun, Guoliang ^{[1
]}

Guan, Cheng ^{[1
]}

Chen, Can ^{[1
]}

Jiang, Zhuangde ^{[1
]}

机构：

[1] Xi An Jiao Tong Univ, State Key Lab Mfg Syst Engn, Xian 710049, Peoples R China

来源：

FRONTIER OF NANOSCIENCE AND TECHNOLOGY | 2011年 / 694卷

关键词：

Subsurface damage; MRF taper polishing; Roughness of surface; Optical element fabrication; SURFACES;

D O I：

10.4028/www.scientific.net/MSF.694.809

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

This paper presents a method of measuring subsurface damage by roughness variation along the bevel surface, which is prepared by MRF taper polishing. Experiments for the ground K9 glass samples show that roughness varies obviously at the position where the subsurface damages go to disappear. Discussions indicate that the method is quantitative and simple for measuring subsurface damage.

引用

页码：809 / 814

页数：6

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