Young's modulus variation with thickness of thin films

被引：0
|
作者：
Zhou, LG [1 ]
Huang, HC [1 ]
机构：
[1] Rensselaer Polytech Inst, Dept Mech Aerosp & Nucl Engn, Troy, NY 12180 USA
来源：
THIN FILMS-STRESSES AND MECHANICAL PROPERTIES X | 2004年 / 795卷
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper describes atomistic determinations of the Young's modulus of free standing thin films, or nanoplates. Using a combination of analytical formulation and molecular statics simulations, we show that the Young's modulus of a nanoplate may either increase or decrease with the thickness. It is the competition of bond saturation and bond loss on surfaces that dictates the increase or decrease. Taking Cu as an example, we demonstrate that the Young's modulus is larger than its bulk counterparts for nanoplates having some surfaces and loading directions, and smaller for others.
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页码：187 / 192
页数：6
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