A study to improve wafer productivity and quality in semiconductor slicing

被引：0

作者：

Dobrescu, Tiberiu

机构：

来源：

ANNALS OF DAAAM FOR 2007 & PROCEEDINGS OF THE 18TH INTERNATIONAL DAAAM SYMPOSIUM: INTELLIGENT MANUFACTURING & AUTOMATION: FOCUS ON CREATIVITY, RESPONSIBILITY, AND ETHICS OF ENGINEERS | 2007年

关键词：

slicing; ID cutting; ID diamond wheels; silicon wafer; wafering techniques;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Although improvements in wafering techniques have produced great saving in device manufacture, further advances in both wafer productivity and quality can be achieved by a systems approach to the slicing operation. This article discusses the advantages and limitations of the several basic types od I.D. slicing machines and the importance of every aspect of the slicing operation to achieving optimum results. The author discusses how improve productivity and quality can be achieved with existing technology..

引用

页码：227 / 228

页数：2

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