Surface chemistry of polyimide formation on Cu(111)

被引:12
|
作者
Child, CM [1 ]
Fieberg, JE [1 ]
Campion, A [1 ]
机构
[1] UNIV TEXAS, DEPT CHEM & BIOCHEM, AUSTIN, TX 78712 USA
基金
美国国家科学基金会;
关键词
adhesion; chemisorption; compound formation; copper; low index single crystal surfaces; metal-insulator interfaces; models of surface chemical reactions; Raman scattering spectroscopy;
D O I
10.1016/S0039-6028(96)01207-1
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We have investigated the adsorption and reaction of the monomers pyromellitic dianhydride (PMDA) and oxydianiline (ODA) to form the intermediate amic acid and then polyimide adsorbed on Cu(111) using solventless vapor deposition in ultrahigh vacuum. Unenhanced surface Raman spectroscopy was used to identify the adsorbed species. The initial reaction of PMDA and ODA at 383 K created an amic acid ion that was bound to the surface via carboxylate and surface amide linkages. Upon heating the intermediate acid to 473 K, polyimide was formed; it was bound to the surface only via a surface carboxylate. The interfacial polymerization produced only relatively short polyimide chains. The surface Raman spectrum of the amic acid was resonantly enhanced.
引用
收藏
页码:L254 / L260
页数:7
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