Wafer-Level Micro-Optics: Trends in Manufacturing, Testing and Packaging

被引:1
|
作者
Voelkel, Reinhard [1 ]
Weible, Kenneth J. [1 ]
Eisner, Martin [1 ]
机构
[1] SUSS MicroOpt SA, CH-2000 Neuchatel, Switzerland
关键词
Micro-optics; microlens array; diffractive optical elements; wafer-level optics; wafer-level packaging; beam shaping; fiber coupling; array illumination; Shack-Hartmann; confocal microscope; slow-axis collimator; INTERFEROMETER; FABRICATION;
D O I
10.1117/12.897114
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Micro-optics is an indispensable key enabling technology (KET) for many applications today. The important role of micro-optical components is based on three different motivations: miniaturization, high functionality and packaging aspects. It is obvious that miniaturized systems require micro-optics for light focusing, light shaping and imaging. More important for industrial applications is the high functionality of micro-optics that allows combining these different functions in one element. In DUV Lithography Steppers and Scanners an extremely precise beam shaping of the Excimer laser profile is required. High-precision diffractive optical elements are well suited for this task. For Wafer-Level Cameras (WLC) and fiber optical systems the packaging aspects are more important. Wafer-Level Micro-Optics technology allows manufacturing and packaging some thousands of sub-components in parallel. We report on the state of the art in wafer-based manufacturing, testing and packaging.
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页数:12
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