Thermal Stress Measurement of a Double Ring Structure Using Digital Image Correlation Method

Structures under a wide range of temperatures have been challenged by thermal problems. In order to assess the safety of structures in a thermal environment, thermal deformation and stress of structures should be determined by analysis and/or experimental method. This article presents a measurement method of the thermal deformation and stress of a double ring structure, which uses the digital image correlation method (DIC). The stress distribution of the double ring was obtained using a two-dimensional stress-strain relation. Efforts to remove measurement noise in the calculation of strain and stress are explained in detail. In order to verify the proposed measurement method, a finite element analysis of the double ring structure was performed using ABAQUS software. The results of DIC-based measurement and finite element analysis were found to be in good agreement.