THERMAL STRAIN MEASUREMENT OF A DOUBLE RING STRUCTURE USING DIGITAL IMAGE CORRELATION METHOD

被引:0
|
作者
Jin, Tailie [1 ]
Goo, Nam Seo [1 ]
机构
[1] Konkuk Univ, Dept Adv Technol Fus, Seoul 143701, South Korea
来源
关键词
Digital image correlation method; thermal output; double ring structure; ARAMIS;
D O I
10.1142/S021797921106674X
中图分类号
O59 [应用物理学];
学科分类号
摘要
Thermal output is a large error source in the thermal deformation measurement of specimens under temperature change when a strain gage is used. Although several methods have been developed and used to compensate thermal output, the range of measuring temperature is limited to several hundred degrees C. In this study, we used a digital image correlation (DIC) method to measure the full-field thermal deformation and strain of a double ring structure consisting of an inner aluminum ring and an outer titanium ring. Thermal deformation of the ring was measured up to 200 degrees C, and a finite element simulation for the heating condition of the double ring structure was performed. The deformation and strain results from the DIC method and simulation were in good agreement.
引用
收藏
页码:4269 / 4272
页数:4
相关论文
共 50 条
  • [1] Thermal Strain Measurement of a Double Ring Structure using Digital Image Correlation Method
    Jin, Tailie
    Goo, Nam Seo
    Kim, Won-Seop
    Lee, Jinho
    [J]. 2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 1015 - 1019
  • [2] Thermal Stress Measurement of a Double Ring Structure Using Digital Image Correlation Method
    Jin, T. L.
    Lee, S. H.
    Goo, N. S.
    [J]. EXPERIMENTAL TECHNIQUES, 2016, 40 (01) : 195 - 205
  • [3] Thermal Stress Measurement of a Double Ring Structure Using Digital Image Correlation Method
    T. L. Jin
    S. H. Lee
    N. S. Goo
    [J]. Experimental Techniques, 2016, 40 : 195 - 205
  • [4] Measurement of Strain in Wood Cutting Using Digital Image Correlation Method
    Matsuda, Yosuke
    [J]. MOKUZAI GAKKAISHI, 2023, 69 (02): : 61 - 65
  • [5] Thermal Strain Measurement Using Digital Image Correlation with Systematic Error Elimination
    Murata, Manabu
    Arikawa, Shuichi
    Yoneyama, Satoru
    Fujimoto, Yasuhisa
    Omoto, Yohei
    [J]. ADVANCEMENT OF OPTICAL METHODS IN EXPERIMENTAL MECHANICS, VOL 3, 2017, : 71 - 76
  • [6] Thermal deformation measurement by digital image correlation method
    Sun, Yaofeng
    Pang, John H. L.
    Shi, Xunqing
    Tew, J. W. Ronnie
    [J]. 2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, 2006, : 921 - +
  • [7] Smoothing algorithm for strain measurement in digital image correlation method
    Qin, Fei
    Wei, Jian-You
    [J]. Beijing Gongye Daxue Xuebao / Journal of Beijing University of Technology, 2008, 34 (08): : 815 - 819
  • [8] A smoothing algorithm for strain measurement by digital image correlation method
    Chen, Na
    Qin, Fei
    Wei, Eanyou
    [J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 192 - 195
  • [9] Measurement of coefficient of thermal expansion of films using digital image correlation method
    Pan, Bing
    Xie, Hui-min
    Hua, Tao
    Asundi, Anand
    [J]. POLYMER TESTING, 2009, 28 (01) : 75 - 83
  • [10] Strain Measurement by Digital Image Correlation
    Withers, Philip J.
    [J]. STRAIN, 2008, 44 (06) : 421 - 422