Planar defects in 4H-SiC PiN diodes

被引:0
|
作者
Twigg, ME [1 ]
Stahlbush, RE
Irvine, KG
Sumakeris, JJ
Chow, TP
Lossee, PA
Zhu, L
机构
[1] USN, Res Lab, Div Elect Sci & Technol, Washington, DC 20375 USA
[2] Cree Inc, Durham, NC 27703 USA
[3] Rensselaer Polytech Inst, Troy, NY 12180 USA
关键词
silicon carbide; PiN diode; transmission electron microscopy (TEM); stacking fault (SF); dislocations;
D O I
10.1007/s11664-005-0109-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Using plan-view transmission electron microscopy (PVTEM), we have identified stacking faults (SFs) and planar defects in 4H-SiC PiN diodes subjected to electrical bias. Our observations suggest that not all planar defects seen in the PiN diodes are SFs. By performing diffraction-contrast imaging experiments using TEM, we can distinguish SFs from other planar defects. In addition, high-resolution TEM (HRTEM) imaging and analytical TEM have revealed that some planar defects consist of a 3-nm-wide SiC amorphous layer. Many of these planar defects are orientated parallel to {1 (1) over bar 00} planes, whereas others are roughly parallel to the (0001) plane. The appearance of these planar defects suggests that they are grain boundaries.
引用
收藏
页码:351 / 356
页数:6
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