Biostability of electronic packaging materials

被引:0
|
作者
Beshchasna, Natalia [1 ]
Uhlemann, Juergen [1 ]
Wolter, Klaus-Juergen [1 ]
机构
[1] Tech Univ Dresden, Elect Packaging Lab, Helmholtzstr 10, D-01062 Dresden, Germany
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Biostability is concerned with the interactions take place between an integrated electronic system, restoring physiological functions often with a long time application and the components of the human body (tissues, fluids, gases, and applied medicaments). Organism with its specific inner conditions (temperature, pressure, pH-value, liquid flow rate, concentration and complex chemical compound) assures for systems constituents (conduct materials, allows, organic and inorganic semiconductor) a stressed medium which accelerates degradable processes (destruction, migration, dissolution, corrosion, delaminating, functions loss, structure alterations, etc.). These processes-difficult interactions mostly on the boundary surface that stand in depending from the contact time. Our main goal is to consider the principles of these interactions, to study alterations through living organisms dynamic loading, to modulate a long time stability of packaging arrangement under bio-stress, to make dynamic measurements with packaging and housing materials and simulated body fluids (for example physiological sodium chloride water solution, synthetic plasma, simulate Liquor cerebrospinalis fluid), to definite quantitative und qualitative alterations of the fluid and materials surface, to rationalize a selection of biomaterials.
引用
收藏
页码:1047 / +
页数:3
相关论文
共 50 条
  • [41] Characterization of electronic packaging materials and components by image correlation methods
    Vogel, D
    Auersperg, J
    Michel, B
    ADVANCED PHOTONIC SENSORS AND APPLICATIONS II, 2001, 4596 : 237 - 247
  • [42] Comparisons of Western and Chinese Textbooks for Advanced Electronic Packaging Materials
    Liu L.
    Yin G.
    Wen J.
    Zhou Q.
    Ding Y.
    Mai L.
    Lecture Notes on Data Engineering and Communications Technologies, 2023, 180 : 954 - 962
  • [43] Recent advances in polymer-based electronic packaging materials
    Wan, Yan-Jun
    Li, Gang
    Yao, Yi-Min
    Zeng, Xiao-Liang
    Zhu, Peng-Li
    Sun, Rong
    COMPOSITES COMMUNICATIONS, 2020, 19 : 154 - 167
  • [44] Materials for 3D packaging of electronic and optoelectronic systems
    Ozguz, VH
    Yamaguchi, J
    MRS BULLETIN, 2003, 28 (01) : 35 - 40
  • [45] The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging
    Wong, EH
    Rajoo, R
    Koh, SW
    Lim, TB
    JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (02) : 122 - 126
  • [46] Preparation of Metallic Materials for Electronic Packaging Based on Space Environment
    Xia, Zhenchao
    Xue, Yahui
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 933 - 936
  • [47] Recent advances in nano-materials for packaging of electronic devices
    Shuye Zhang
    Xiangyu Xu
    Tiesong Lin
    Peng He
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 13855 - 13868
  • [48] Cu-SiCp composites as advanced electronic packaging materials
    Azmi, K.
    Derman, M. N.
    Al Bakri, A. M. Mustafa
    Sandu, A. V.
    ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY II, 2014, 594-595 : 852 - +
  • [49] Current Status of Electronic Packaging Materials Using Machine Learning
    Zhang S.
    Duan X.
    Luo K.
    Xu S.
    Zhang Z.
    Chen J.
    He P.
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2023, 59 (22): : 222 - 233
  • [50] Enhanced Terahertz imaging of electronic packaging materials with deconvolution algorithm
    Zheng, Chan
    Song, Zheyu
    Yan, Shihan
    Liu, Jingbo
    Ling, Dongxiong
    Wei, Dongshan
    Zhou, Jinyun
    2019 INTERNATIONAL CONFERENCE ON OPTICAL INSTRUMENTS AND TECHNOLOGY: IRMMW-THZ TECHNOLOGIES AND APPLICATIONS, 2020, 11441