Digital Scanner Infrared Focal Plane Technology

被引：0

作者：

Ortiz, M. A. ^{[1
]}

Malone, N. R. ^{[1
]}

Harris, M. ^{[1
]}

Shin, J. ^{[1
]}

Byers, S. ^{[1
]}

Price, D. ^{[1
]}

Vampola, J. ^{[1
]}

机构：

[1] Raytheon Vis Syst, Goleta, CA 93117 USA

来源：

INFRARED REMOTE SENSING AND INSTRUMENTATION XIX | 2011年 / 8154卷

关键词：

Short Wave Infrared (SWIR); Focal Plane Array (FPA); Mercury Cadmium Telluride; HgCdTe; Infrared detectors; history; Analog to Digital Convertor; LVDS; Digital; Read Out Integrated Circuit (ROIC); Time Delay Integration (TDI);

D O I：

10.1117/12.897342

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Advancements in finer geometry and technology advancements in circuit design now allow placement of digital architecture on cryogenic focal planes while using less power than heritage analog designs. These advances in technology reduce the size, weight, and power of modern focal planes. In addition, the interface to the focal plane is significantly simplified and is more immune to Electromagnetic Interference (EMI). The cost of the customer's instrument after integration with the digital scanning Focal Plane Array (FPA) has been significantly reduced by placing digital architecture such as Analog to digital convertors and Low Voltage Differential Signaling (LVDS) Inputs and Outputs (I/O) on the Read Out Integrated Circuit (ROIC).

引用

页数：8

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