Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology

被引：0
|
作者：
Shen, Chi-Kai [1 ,2 ]
Tsai, Ming-Hsien [3 ]
Chen, Huan-Neng [3 ]
Jou, Chewn-Pu [3 ]
Liu, Sally [3 ]
Hsueh, Fu-Lung [3 ]
Wu, Tzong-Lin [1 ,2 ]
机构：
[1] Natl Taiwan Univ, Dept Elect Engn, Taipei, Taiwan
[2] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei, Taiwan
[3] Taiwan Semicond Mfg Co, Mixed Signal RF Solut Div, Hsinchu, Taiwan
来源：
2015 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC) | 2015年
关键词：
Chebyshev prototype; electromaganetic bandgap (EBG); integrated fan-out wafer-level packaging (InFO-WLP); lowpass filter (LPF); microstrip fiter; step-impedance; tapered structure;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the microwave lowpass filters in integrated fan-out wafer-level packaging (InFO-WLP) technology. The Chebyshev prototype is adopted to achieve sharp cutoff at the edge of passband. A lumped-LC structure and three different distributed structures, including lambda/8 stubs, stepped-impedance, and periodic tapered electromagnetic bandgap (EBG), are employed to find an appropriate microwave LPF realized in InFO-WLP technology. The simulation results exhibit the proposed LPF using lumped-LC structure can achieve the smallest size with the accepted ripple in passband and good suppression in stopband at the cutoff frequency of similar to 10 GHz. To the best of authors' knowledge, this is the first to study microwave filters in InFO-WLP technology.
引用
收藏
页码：246 / 248
页数：3
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