共 44 条
- [11] A Novel Dimensional Analysis Method for TSV Modeling and Analysis in Three Dimensional Integrated Circuits 2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 2764 - 2767
- [12] A novel patterning method for metal-organic precursors on a SiOx/Si substrate using a local electric field FUNCTIONAL NANOSTRUCTURED MATERIALS THROUGH MULTISCALE ASSEMBLY AND NOVEL PATTERNING TECHNIQUES, 2002, 728 : 87 - 92
- [13] Novel Imaging Method and Optimized Demodulation Pixels for Wide-Field Fluorescence Lifetime Imaging Microscopy 2011 IEEE SENSORS, 2011, : 724 - 727
- [15] A novel method for aircraft attitude estimation using magnetic field sensors and dynamic modeling SOUTHCON/96 - CONFERENCE RECORD, 1996, : 536 - 538
- [19] Integrated novel modeling approaches for non-uniform heat source and temperature field in gear profile grinding The International Journal of Advanced Manufacturing Technology, 2024, 130 : 4397 - 4414
- [20] Integrated novel modeling approaches for non-uniform heat source and temperature field in gear profile grinding INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2024, 130 (9-10): : 4397 - 4414