High-frequency AlGaN/GaN T-gate HEMTs on extreme low resistivity silicon substrates

被引:2
|
作者
Liu, Yeke [1 ]
Li, Cheng-Han [1 ]
Hsu, Wen-Ching [2 ]
Chuang, Chih-Yuan [2 ]
Liu, Jia-Zhe [2 ]
Hsu, Shawn S. H. [1 ]
机构
[1] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 30013, Taiwan
[2] Global Wafers Co Ltd, Innovat Technol Res Ctr, Hsinchu 30013, Taiwan
关键词
PLASTIC-DEFORMATION; GAN; TRANSISTORS; POWER;
D O I
10.35848/1347-4065/ab70a5
中图分类号
O59 [应用物理学];
学科分类号
摘要
The T-gate high frequency AlGaN/GaN high electron mobility transistors (HEMTs) are demonstrated on an 8 inch extremely-low resistivity (ELR) silicon substrate with a resistivity of similar to 2.5 m Omega cm to investigate the potential of using the ELR Si substrate for RF applications. The devices are also fabricated on the 60 a cm substrate for comparison, The 0.1 mu m T-gate is realized by e-beam lithography to improve the high frequency characteristics of the devices. The short-circuit current gain cutoff frequency (f(T)), the maximum oscillation frequency (f(max)), and maximum transconductance (g(m.max)) of 27 GHz, 71 GHz and 247 mS mm(-1) can be achieved, respectively. The obtained high frequency performance is among the best reported to date for the GaN HEMTs on such low resistivity silicon substrates. (C) 2020 The Japan Society of Applied Physics
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页数:5
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