Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates

被引：6
|
作者：
Jeon, I [1 ]
Omiya, M
Kishimoto, K
Asahina, T
Im, S
机构：
[1] Natl Inst Adv Ind Sci & Technol, Mat Res Inst Sustainable Dev, Moriyama Ku, Nagoya, Aichi 4638560, Japan
[2] Tokyo Inst Technol, Dept Mech & Control Engn, Meguro Ku, Tokyo 1528552, Japan
[3] Korea Adv Inst Sci & Technol, Dept Mech Engn, Taejon 305701, South Korea
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 2005年 / 122卷 / 02期
关键词：
G(c)-sensing element; indentation; metal thin films; interfacial toughness;
D O I：
10.1016/j.sna.2005.04.017
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new type of the sensitive specimen named 'G(c)-sensing element' that can be fabricated, using the plain and general micro-fabrication process, is proposed and modeled to measure the interfacial toughness G(c) of metal thin films on substrates. For the whole modeling process of the G(c)-sensing element, the finite element method and the concepts of the linear elastic fracture mechanics are applied. Moreover, the verification for energy-release rates calculated from the linear elastic fracture analysis is carried out, using the elastic-plastic fracture analysis. The results of this research show that the G(c)-sensing element provides a simple and convenient method for measuring the precise interfacial toughness of metal thin films on substrates. (C) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：291 / 300
页数：10
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