A Numerical Study on Taylor Flow Heat Transfer in Square Microchannels Under Constant Wall Temperature Boundary Condition

被引:0
|
作者
Talimi, V. [1 ]
Muzychka, Y. S. [1 ]
Kocabiyik, S.
机构
[1] Mem Univ Newfoundland, Fac Engn & Appl Sci, Microfluid & Multiphase Flow Res Lab, St John, NF A1B 3X5, Canada
关键词
Heat Transfer; Square Microchannel; Two-Phase Flow; Slug Flow; Numerical Simulation; SLUG FLOW; LONG BUBBLES; 2-PHASE FLOW; SIMULATIONS; DEPOSITION; LIQUID; FLUID;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Heat transfer in Taylor flows or slug flows has been examined exclusively by researchers. Noncircular microchannels have not been widely considered in the literature. There is a large gap in research since noncircular microchannels are common structures in microcooling processes. Square and rectangular microchannels are the most important examples. In the present study the heat transfer process in slug flows in square microchannels has been investigated numerically under constant wall temperature boundary condition. The local heat flux for the moving slugs has been converted to total microchannel heat flux using the integration methods suggested recently by the authors. This leads to microchannel wall average heat flux which is the parameter of interest in heat sink problems. Finally, effects of liquid film around bubbles on heat transfer process have been discussed.
引用
收藏
页码:2041 / 2049
页数:9
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