Magnesium hydride film formation using subatmospheric pressure H2 plasma at low temperature

被引:4
|
作者
Ohmi, Hiromasa [1 ]
Kakiuchi, Hiroaki [1 ]
Yasutake, Kiyoshi [1 ]
机构
[1] Osaka Univ, Dept Precis Sci & Technol, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan
来源
关键词
MGH2; THIN-FILMS; HYDROGEN STORAGE; KINETICS; DESORPTION; IDENTIFICATION; RECOMBINATION; DECOMPOSITION; ABSORPTION; DEPOSITION; TRANSPORT;
D O I
10.1116/1.4952705
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
MgH2 films were prepared using pure hydrogen plasma under subatmospheric pressures ranging from 13.3 to 53.3 kPa (100-400 Torr). The prepared films were characterized by scanning electron microscopy, x-ray diffraction (XRD), and temperature programmed desorption measurements. The ratio of MgH2 to Mg in the prepared films was evaluated, as the degree of Mg hydrogenation, by XRD analysis. The plasma was found to be indispensable for the preparation of thick MgH2 film near normal hydrogen pressure. Hydrogen plasma exposure treatment after Mg film formation had only a very small effect on thick MgH2 film formation, despite the use of subatmospheric pressure hydrogen plasma with high H atom density. Simultaneous supply of Mg and atomic hydrogen was found to be important in preparing thick MgH2 films. Therefore, the surface reaction between Mg and H appears to play an important role in the growth process. The flux ratio (Gamma(H)/Gamma(Mg)) of atomic H and Mg required to prepare highly hydrogenated Mg was found to be more than 100. The resulting degree of hydrogenation of the prepared MgH2 film was as good or better than that of commercial powders. MgH2 film prepared on Si substrate exhibited growth with (211) preferred orientation as the deposition rate was decreased, and a columnar structure along the growth direction. The deposition rate reached 2.9 mu m/min while still maintaining a high degree of hydrogenation. (C) 2016 American Vacuum Society.
引用
收藏
页数:10
相关论文
共 50 条
  • [21] Chemical Transport Deposition of Purified Poly-Si Films from Metallurgical-Grade Si Using Subatmospheric-Pressure H2 Plasma
    Yasutake, Kiyoshi
    Ohmi, Hiromasa
    Kakiuchi, Hiroaki
    AMORPHOUS AND POLYCRYSTALLINE THIN-FILM SILICON SCIENCE AND TECHNOLOGY - 2010, 2010, 1245 : 215 - 226
  • [22] Nanographene synthesis on metal film using pentacene, H2 gas and heated W mesh at low temperature
    Heya, Akira
    Sumitomo, Koji
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2021, 60 (SB)
  • [23] Influence of hydrogen dilution on low-temperature polycrystalline silicon formation using RF excitation SiH4/H2 plasma
    Yao, RH
    Lin, XY
    Wu, P
    Yu, CY
    Shi, WZ
    Lin, KX
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2000, 62 (1-2) : 187 - 192
  • [24] Formation of Double Roughness Structure on PVDF/PMMA Blended Film Using Atmospheric Pressure Low-Temperature Plasma
    Yamamoto, Masashi
    Takada, Ayumu
    Fujii, Nanaho
    Sekiguchi, Atsushi
    Horibe, Hideo
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2024, 37 (04) : 355 - 362
  • [25] Passivated thick film catalytic type H2 sensor operating at low temperature
    Katti, VR
    Debnath, AK
    Gadkari, SC
    Gupta, SK
    Sahni, VC
    SENSORS AND ACTUATORS B-CHEMICAL, 2002, 84 (2-3) : 219 - 225
  • [26] Deactivation of lipopolysaccharide by Ar and H2 inductively coupled low-pressure plasma
    Bartis, E. A. J.
    Barrett, C.
    Chung, T-Y
    Ning, N.
    Chu, J-W
    Graves, D. B.
    Seog, J.
    Oehrlein, G. S.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (04)
  • [28] Reversible Hydrogen and Pd Hydride Reference Electrodes with Electrochemically Supplied H2 for High Temperature and Pressure Electrochemistry
    Leuaa, Pradipkumar
    Chatzichristodoulou, Christodoulos
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2022, 169 (05)
  • [29] Nonhalogen Dry Etching of Metal Carbide TiAlC by Low-Pressure N2/H2 Plasma at Room Temperature
    Nguyen, Thi-Thuy-Nga
    Shinoda, Kazunori
    Hsiao, Shih-Nan
    Maeda, Kenji
    Yokogawa, Kenetsu
    Izawa, Masaru
    Ishikawa, Kenji
    Hori, Masaru
    ACS APPLIED MATERIALS & INTERFACES, 2024, 16 (39) : 53195 - 53206
  • [30] Low-pressure H2/N2 annealing on indium tin oxide film
    Chang, Shang-Chou
    MICROELECTRONICS JOURNAL, 2007, 38 (12) : 1220 - 1225