Integration of Electronics and Photonics on Monolithic Silicon to Improve the Performance of Conventional Electronics

被引:0
|
作者
Gebreyesus, Hagos [1 ]
Alemu, Getachew [1 ]
机构
[1] Addis Ababa Univ, Addis Ababa Inst Technol, Sch Elect & Comp Engn, Addis Ababa, Ethiopia
来源
关键词
Electronics; Photonics; Monolithic Silicon; Plasmonics; waveguides;
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
In the existing electronic devises, chip-to-chip and onchip interconnects are based on copper wires. However, copper interconnects have created problems on the performance and functionality of conventional electronics devices by imposing parasitic load that leads to limit in speed, lower bandwidth, increased power consumption(high heating on the devices) and electromagnetic interferences. On the other hand, photonic interconnects have advantages of large band width, lower power consumption and are immune to electromagnetic interferences. The presented work, integration of electronic and photonic devices, have merged the advantages of both technologies (the electronics for data processing and storage, and photonics for both on-chip and off-chip interconnections). Based on the experimental results, the power consumption and delay in copper interconnects were recorded higher than in photonic (glass rod) by 60% and 62.8% respectively.
引用
收藏
页码:639 / 643
页数:5
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