Enhanced [111] preferred orientation of Ag thin film on amorphous SiO2 by Cu addition

被引：0
|
作者：
Zoo, Yeongseok [1 ]
Han, Hauk [1 ]
Alford, Terry L. [1 ]
机构：
[1] Arizona State Univ, Sch Mat, Tempe, AZ 85287 USA
来源：
MATERIALS, PROCESSES, INTEGRATION AND RELIABILITY IN ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS | 2007年 / 990卷
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D O I：
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中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Small amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO2 substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.
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页码：141 / 146
页数：6
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