The effects of ultrasonic treatments on the microstructure and mechanical properties of SAC0307 solder

被引:5
|
作者
Chen, Haiyan [1 ]
Chen, Ziliang [1 ]
Lai, Zhenmin [1 ]
Li, Yi [2 ]
Guo, Li [3 ]
机构
[1] Guangdong Univ Technol, Sch Mat & Energy, Guangzhou 510006, Guangdong, Peoples R China
[2] Univ Sheffield, Sch Math & Stat, Hicks Bldg,Hounsfield Rd, Sheffield S3 7RH, S Yorkshire, England
[3] Stannum Ind Co Ltd, Huizhou 516123, Guangdong, Peoples R China
关键词
Lead-free solder; Metal casting; Ultrasonic treatments; Cavitation; Bubble dynamics; SOLIDIFICATION MICROSTRUCTURE; IRRADIATION; VIBRATION;
D O I
10.1016/j.jmatprotec.2018.11.025
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The microstructures and physical properties of SAC0307 lead-free solder formed by an ultrasound-assisted semisolid casting process were analyzed. The damages to a thin aluminium foil placed in the alloy melt at 226 degrees C showed strong effects of acoustic streaming. Significant erosion due to cavitation was found for powers higher than 450 W. Numerical simulations of a collapsing cavitation bubble obtained the highest peak pressure and temperature when the ultrasonic power was around 550 W. When the ultrasonic power was between 500 W and 600 W, sub-grains were observed and the crystal grains became equiaxed with the smallest average grain size of about 140 mu m. The highest tensile strength found in this range was about 36.6 MPa. The density was 7.35 g/cm(3). The elongation at break was about 60%, which was 40% higher than the value obtained by traditional casting techniques.
引用
收藏
页码:619 / 626
页数:8
相关论文
共 50 条
  • [31] Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints
    Zongxiang Yao
    Shan Jiang
    Limeng Yin
    Diying Ling
    Zhongwen Zhang
    Liping Zhang
    Journal of Electronic Materials, 2020, 49 : 5391 - 5398
  • [32] Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints
    Han Xu
    Xudong Zhang
    Wenjing Chen
    Minming Zou
    Xiaowu Hu
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 22810 - 22819
  • [33] Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints
    Yao, Zongxiang
    Jiang, Shan
    Yin, Limeng
    Ling, Diying
    Zhang, Zhongwen
    Zhang, Liping
    JOURNAL OF ELECTRONIC MATERIALS, 2020, 49 (09) : 5391 - 5398
  • [34] EFFECTS OF SHEAR CYCLING ON THE MECHANICAL PROPERTIES OF SAC AND SAC plus X LEAD FREE SOLDER JOINTS
    Hogue, Mohd Aminul
    Chowdhury, Md Mahmudur
    Hamasha, Sa'd
    Suhling, Jeffrey C.
    Lall, Pradeep
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019, 2020,
  • [35] Effect of Shock Wave on Micromechanical Properties of SAC 0307/ENiG Solder Joint using Nanoindentation Approach
    Abu Bakar, Maria
    Jalar, Azman
    Yusoff, Wan Yusmawati Wan
    Safee, Nur Shafiqa
    Ismail, Ariffin
    Ismail, Norliza
    Salleh, Emee Marina
    Ibrahim, Najib Saedi
    SAINS MALAYSIANA, 2019, 48 (06): : 1273 - 1279
  • [36] Effects of Cu foam on microstructure and mechanical properties of SAC305 solder joints bonded with solid-liquid electromigration
    Hu, Xiaowu
    Zhang, Zezong
    Chen, Wenjing
    Mao, Xin
    Ma, Yan
    Xiao, Shikun
    Huang, Hai
    Wang, Jue
    Chen, Bin
    Li, Qinglin
    Jiang, Xiongxin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (11)
  • [37] SAC solder paste with carbon nanotubes. Part II: carbon nanotubes' effect on solder joints' mechanical properties and microstructure
    Bukat, Krystyna
    Sitek, Janusz
    Koscielski, Marek
    Niedzwiedz, Wojciech
    Mlozniak, Anna
    Jakubowska, Malgorzata
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 25 (04) : 195 - 208
  • [38] Strain-Rate Effects on Mechanical Properties for SAC387 and SAC105-Y Solder
    Xu, Luhua
    Tan, Kok Ee
    Pang, John H. L.
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 845 - 850
  • [39] Ultrasonic Soldering, Mechanical Properties of Solder Joints
    Dusek, Karel
    Placek, Martin
    Cepek, Martin
    Molhanec, Martin
    Pelikanova, Ivana Beshajova
    2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2017,
  • [40] THE EFFECTS OF THERMAL HISTORY ON THE MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF SOLDER ALLOYS
    FROST, HJ
    STONE, GJ
    HOWARD, RT
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 121 - 127