共 50 条
- [31] Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints Journal of Electronic Materials, 2020, 49 : 5391 - 5398
- [32] Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints Journal of Materials Science: Materials in Electronics, 2020, 31 : 22810 - 22819
- [34] EFFECTS OF SHEAR CYCLING ON THE MECHANICAL PROPERTIES OF SAC AND SAC plus X LEAD FREE SOLDER JOINTS PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019, 2020,
- [35] Effect of Shock Wave on Micromechanical Properties of SAC 0307/ENiG Solder Joint using Nanoindentation Approach SAINS MALAYSIANA, 2019, 48 (06): : 1273 - 1279
- [38] Strain-Rate Effects on Mechanical Properties for SAC387 and SAC105-Y Solder ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 845 - 850
- [39] Ultrasonic Soldering, Mechanical Properties of Solder Joints 2017 40TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2017,
- [40] THE EFFECTS OF THERMAL HISTORY ON THE MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF SOLDER ALLOYS MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 121 - 127