Switching current imbalance mitigation in power modules with parallel connected SiC MOSFETs

被引:0
|
作者
Beczkowski, Szymon [1 ]
Jorgensen, Asger Bjorn [1 ]
Li, Helong [2 ]
Uhrenfeldt, Christian [1 ]
Dai, Xiaoping [2 ]
Munk-Nielsen, Stig [1 ]
机构
[1] Aalborg Univ, Dept Energy Technol, Aalborg, Denmark
[2] DYNEX Semicond, Lincoln, England
关键词
packaging; power semiconductor device; silicon carbide (SiC); parallel operation;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Multichip power modules use parallel connected chips to achieve high current rating. Due to a finite flexibility in a DBC layout, some electrical asymmetries will occur in the module. Parallel connected transistors will exhibit uneven static and dynamic current sharing due to these asymmetries. Especially important are the couplings between gate and power loops of individual transistors. Fast changing source currents cause gate voltage imbalances yielding uneven switching currents. Equalizing gate voltages seen by paralleled transistors, done by adjusting source bond wires, is proposed in this paper. Analysis is performed on an industry standard DBC layout using numerically extracted module parasitics. The method of tuning individual source inductances shows clear improvement in dynamic current balancing and prevents excessive current overshoot during transistors turn-on.
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页数:8
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