Study on Technology of Picosecond Laser Making Micro-Hole with Helical Drilling

被引:3
|
作者
Liu Xiaodong [1 ,2 ]
Chen Liang [1 ,2 ]
Wang Xizhao [1 ]
Xiong Zhengjun [1 ]
机构
[1] South Cent Univ Nationalities, Inst Laser & Intelligent Mfg, Wuhan 430074, Hubei, Peoples R China
[2] South Cent Univ Nationalities, Coll Elect & Informat Engn, Wuhan 430074, Hubei, Peoples R China
关键词
laser processing; picosecond laser; helical drilling; stainless steel; micro-hole; FEMTOSECOND; ADAPTION; COPPER;
D O I
10.3788/LOP202259.0714005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to explore the high-quality forming process of micro-holes, the picosecond laser combined with helical drilling technology was used to carry out the basic experiments of micro-hole forming. The shape (taper and size) of the micro-hole can be controlled by changing the deflection angle and translation of the wedge prism in the optical path of the rotating optical system. Taking 1-mm 304 stainless steel as an example, the influence of processing parameters such as laser pulse energy, defocusing amount, repetition frequency and laser helical drilling speed on the quality of micro-hole processing was studied. According to the experimental results, laser pulse energy is the key factor of micro-hole forming quality, defocusing amount can change the taper of the micro-hole to a certain extent, and the repetition frequency and rotation speed of the laser determine the thermal influence of the micro-hole and the thickness of the recasting layer. While laser pulse energy is 141 mu J, repetition frequency is 66.67 kHz, defocusing amount is +0.1 mm, and laser helical drilling speed is 8000 r/min, the high-quality micro-holes with pore diameters ranging from 100 to 300 mu m and controllable tapers can be obtained.
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页数:9
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